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MemoryDevices(Dong Guan Wei Tai Electronics) |
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PC2-5300 / DDR2-667 200 Pin DDRII SO-DIMM Capacity Chip Configuration Chip Type 256MB 32Mx8 (x8) DDRII SDRAM 256MB 32Mx16 (x4) DDRII SDRAM 512MB 64Mx8 (x8) DDRII SDRAM 1GB 64Mx8 (x16) DDRII SDRAM
Feature: 200 edge connector pads Clock Frequency 667 MHz SSTL-2 interface 1.8 Voltage +/- 0.1V Package FBGA
Specification: Double Data Rate architecture Bandwidth(max.): 5.3GB/s JEDEC standard Serial Presence Detect support MRS cycle with address key programs * CAS latency: 3, 4 & 5(clock) * Burst length: 4&8 * Burst type: Sequential & Interleave 2 variations of refresh * Auto refresh * Self refresh |
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