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Motech Taiwan Automatic Corp. |
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AUTO DIE BOND SYSTEM, the model DBLF1000, a semi-automatic machine, was designed for the demand of Die sticks onto a conducting wire by means of manual delivering. With regard to different types of conducting wires, it only needs to adjust parameters via touch panel. It is quite easy and convenient to operate the machine for the user. The same type but different sizes of Die also can be applied to just through an ease modulation. Auto Die Bond System can make your company obtain the highest beneficial result. Motech devoted to high precision reliable equipment and professional service as our orientation to provide semiconductor industry with more advanced. High speed productive machinery. |
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